兴森科技，秉承“用芯联接数字世界”的理念，致力成为全球先进电子电路方案数字制造领军者。特别是在半导体领域，产品线包括支持半导体芯片的ATE测试板、CSP和FCBGA基板。关于ATE板和CSP基板的介绍，已在《兴森大求真》第三期和第四期详细展开。而在即将到来的第六期中，我们将重点介绍FCBGA基板，这也是兴森FCBGA基板工厂首次对外展示，重量级内容不容错过。

链接：https://mp.weixin.qq.com/s/XN_JEH2_X6XzpQLMB2eZJA

·····················································································································································································································································································