对岸开始发力，我们会不会加大力度？？

知情人士称，美国计划在 3 月底之前宣布重大芯片拨款，为向半导体制造商提供数十亿美元资金以增强国内生产铺平道路。

这些奖项计划授予英特尔公司和其他芯片制造商，是 2022 年《芯片与科学法案》的核心部分，该法案拨出 390 亿美元的直接拨款来振兴美国制造业。

英特尔表示，这笔赠款将决定其扩张项目的进展速度，其中包括计划在俄亥俄州建造世界上最大的工厂。台积电和三星电子等海外芯片制造商也有望获得部分资金，帮助他们支付在美国建厂的费用。

到目前为止，这笔资金的发放进展缓慢，在拜登将这一具有里程碑意义的倡议签署为法律一年多后，只宣布了两笔小额赠款。这项努力旨在重新平衡华盛顿所认为的危险的生产集中在东亚的情况，是拜登在 11 月大选前传达的经济信息的一个关键支柱。它有望在全国各地的新制造中心提供数千个高薪工厂工作岗位。

时间安排表明，这些奖项可能会在乔·拜登总统3 月 7 日发表国情咨文演讲之前揭晓。白宫和英特尔的发言人拒绝发表评论。

阅读更多：前银行家帮助分配 1000 亿美元以促进美国芯片制造

商务部长吉娜·雷蒙多表示，她的机构计划今年颁发大约十几个奖项，其中包括几笔数十亿美元的赠款，以支持先进的芯片制造设施。这些奖励可能以赠款、贷款和贷款担保的形式提供，最多可覆盖项目成本的 15%。美国商务部拒绝置评。

对于芯片制造商来说，这些支出将有助于缓解建设设施的财务影响，这些设施可能耗资高达 300 亿美元，但在十年内就会过时。近年来，半导体公司已承诺在美国投资超过 2300 亿美元，其中许多投资的明确条件是获得政府支持。

英特尔首席执行官帕特·基辛格(Pat Gelsinger)一直是该资金的主要行业游说者。他的公司曾经是世界上最大的芯片制造商，但现在已经落后于竞争对手，而大兴土木是基辛格东山再起计划的一部分。

英特尔正在亚利桑那州和俄亥俄州建设或规划工厂，并在德国设立新工厂，首席执行官希望欧洲的支持。

全球最大的芯片制造商台积电计划斥资 400 亿美元在亚利桑那州建造两座制造工厂。但由于第一个工厂的劳动力和成本挑战，该公司推迟了两个工厂的生产开始时间。该公司最近表示，美国的激励措施将有助于确定第二座设施内技术的先进程度。

原文

The US is aiming to announce major chip grants by the end of March, people familiar with the plans said, paving the way to send billions of dollars to semiconductor makers in a bid to supercharge domestic production.

The awards — slated to go to Intel Corp. and other chipmakers — are a central piece of the 2022 Chips and Science Act, which set aside $39 billion in direct grants to revitalize US manufacturing.

Intel has said that the grants will determine how quickly it progresses with expansion projects, including a planned facility in Ohio that would be the world’s largest. Overseas chipmakers such as Taiwan Semiconductor Manufacturing Co. and Samsung Electronics Co. also are expected to get a portion of the funds, helping them pay for factories in the US.

The money has been slow to trickle out so far, with only two small grants announced more than a year after Biden signed the landmark initiative into law. The effort, aimed at rebalancing what’s seen in Washington as a dangerous concentration of production in East Asia, is a key pillar of Biden’s economic message heading into the November election. It brings promises of thousands of well-paying factory jobs in new manufacturing hubs across the country.

The timing suggests the awards may be unveiled before President Joe Biden’s State of the Union address on March 7. Spokespeople for the White House and Intel declined to comment.

Read more: Ex-Bankers Help Divvy Up $100 Billion to Boost US Chipmaking

Commerce Secretary Gina Raimondo has said her agency plans to make about a dozen awards this year, including several multibillion-dollar grants to support advanced chipmaking facilities. The awards, which could come as a combination of grants, loans and loan guarantees, will cover up to 15% of project costs. The Commerce Department declined to comment.

For chipmakers, the disbursements will help cushion the financial impact of building facilities that can cost as much as $30 billion and yet be obsolete within a decade. Semiconductor companies have pledged to invest more than $230 billion in the US in recent years, many on the explicit condition that they receive government support.

Intel Chief Executive Officer Pat Gelsinger has been the leading industry voice lobbying for that funding. His company, once the world’s biggest chipmaker, has fallen behind rivals and a construction spree is part of Gelsinger’s comeback plan.

Intel is building or planning factories in Arizona and Ohio, as well as a new site in Germany — where the CEO is counting on European support.

TSMC, the world’s largest manufacturer of chips, plans to spend $40 billion to build two fabrication facilities in Arizona. But the company has delayed the start of production at both sites due to labor and cost challenges at the first one. It said recently that US incentives will help determine how advanced the technology inside the second facility will be.